Hell, AMD uses solder on their APUs, same kind as the HEDT ones that Intel uses. Person that took it off destroyed the chip though due to heating it up to melt the solder and couldn't use a vice due to how the package is set up. A huge difference between Sandy Bridge and current ones is that the thermal interface between the die and the heat spreader is that Sandy Bridge used solder which really helped a lot with overclocking in the thermal department, however from Ivy Bridge on they used crappy TIM. Think the usual temperature delta is around 10-15C(?, going from crappy tim to liquid metal anyways) Not entirely sure.
https://www.techpowerup.com/228255/a...-apu-de-lidded