Yes ... that doesn't change anything in my statement to yours where you stated it's a HEDT derivative where it's not.
Coffee Lake is a refinement of Kaby Lake (repeating myself here) and therefore it CANNOT be from a HEDT family of processors.
According your very article it states that all Coffee Lake-S products (the mainstream DT processors, like the 7700K from Kaby Lake) will be part of the Z370 first and later Z390 chipset update, so yes ... all Coffee Lake products.
There's a big difference between Ryzen and Intel in their 14nm efficiency lithography.
AMD's Ryzen is simply more power efficient, there's no denying that at all.
But it depends upon how much power you're pushing through the chips and what speeds you're giving them to maintain that TDP.
Intel is going from a 91W TDP from the 7700K Kaby Lake to 95W TDP 8700K Coffee Lake with, so far leaked, absurd Turbo speeds.
It would mean that Intel has found a way to improve their Kaby Lake uArch to such a point as to get another 60%+ power efficiency out of them if they can stick to their TDP or straight up lie about their TDP rating.
My guess is the latter as improving power efficiency by 60% on the same uArch and same lithography isn't happening, even for a giant such as Intel.
That still doesn't change the fact that there's no different power circuitry as all the basics are powering it as it should be within the same envelope and the same pinout system, it's still LGA1151 and prototyping was done on Z270 boards... there's no difference.
Holding back Z270 support from the Coffee Lake CPUs, I would've thought that'd be obvious in my statements, Coffee Lake will not have FIVR.. they made that mistake with Ivy Bridge IIRC and they dumped it almost immediately.
Adding a FIVR makes the CPU considerably hotter and inefficient vs. mobo controlled.
Because their Skylake/Kaby Lake process simply isn't near the same level of efficiency even if they soldered it.
The leap of improvement would be huge, one of which is normally accredited only to lithography jumps.
We're not getting any here and Skylake is technically more power efficient than Kaby Lake.
Solder will not "save" them here on that TDP rating.