No 2 CPUs are identical, you have higher quality silicon (natural part of the process), speed and operating voltages at said speed.
1 may be extremely efficient requiring lower voltages than the other, center silicon wafer, and the other may come from the edges.
1 may be clocked considerably higher and require more operating voltage than the other.
You may have 1 which is inefficient and requires more operating voltage as well as being clocked higher with speeds, which is what AMD bases it's TDP upon the maximum voltage x electrical current required for operation and cooling to associate with that.
There's a plethora of reasons of why and how but let's get to that shall we as with your very example.
Weren't you the one who stated the following?
So what is it now then as you first say it is based upon heat dissipation and now not.
Even though this is a power virus so consumption goes beyond stated TDP as ordinary software cannot generate the same thing:
Click me for a picture!
Or are you saying these readings do not properly convey the differences since you don't believe there's a difference?
Also check out the 7700K there ... higher power draw than a 95W TDP CPU whilst itself is 91W ... strange ... the difference mustn't be in the uArch or anything, it must be because it's got no solder under the hood.
Do you think there would be a meaningful change to power draw and cooling requirements if you were to repeat the same test with a soldered/delidded CPU?
Also still dodging... yes you are very much lacking.